Effect of Tin Grain Orientation on Electromigration-Induced Dissolution of Ni Metallization in SnAg Solder Joints

In this study, symmetrical solder joints (Cu/Ni/SnAg(2.3)/Ni/Cu) were fabricated. They were electromigration (EM)-stressed at high (8 [Formula: see text] 10(4) A/cm(2)) or low (1.6 [Formula: see text] 10(4) A/cm(2)) current densities. Failures in the solder joints with different grain orientations u...

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Detalles Bibliográficos
Autores principales: Hsu, Po-Ning, Lee, Dai-Lung, Tran, Dinh-Phuc, Shie, Kai-Cheng, Tsou, Nien-Ti, Chen, Chih
Formato: Online Artículo Texto
Lenguaje:English
Publicado: MDPI 2022
Materias:
Article
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC9605473/
https://www.ncbi.nlm.nih.gov/pubmed/36295180
http://dx.doi.org/10.3390/ma15207115

Internet

https://www.ncbi.nlm.nih.gov/pmc/articles/PMC9605473/
https://www.ncbi.nlm.nih.gov/pubmed/36295180
http://dx.doi.org/10.3390/ma15207115

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