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Effect of Tin Grain Orientation on Electromigration-Induced Dissolution of Ni Metallization in SnAg Solder Joints
In this study, symmetrical solder joints (Cu/Ni/SnAg(2.3)/Ni/Cu) were fabricated. They were electromigration (EM)-stressed at high (8 [Formula: see text] 10(4) A/cm(2)) or low (1.6 [Formula: see text] 10(4) A/cm(2)) current densities. Failures in the solder joints with different grain orientations u...
| Autores principales: | , , , , , |
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| Formato: | Online Artículo Texto |
| Lenguaje: | English |
| Publicado: |
MDPI
2022
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| Materias: | |
| Acceso en línea: | https://www.ncbi.nlm.nih.gov/pmc/articles/PMC9605473/ https://www.ncbi.nlm.nih.gov/pubmed/36295180 http://dx.doi.org/10.3390/ma15207115 |