Progress of Polymer-Based Thermally Conductive Materials by Fused Filament Fabrication: A Comprehensive Review

With the miniaturization and integration of electronic products, the heat dissipation efficiency of electronic equipment needs to be further improved. Notably, polymer materials are a choice for electronic equipment matrices because of their advantages of low cost and wide application availability....

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Detalles Bibliográficos
Autores principales: Cai, Zewei, Thirunavukkarasu, Naveen, Diao, Xuefeng, Wang, Haoran, Wu, Lixin, Zhang, Chen, Wang, Jianlei
Formato: Online Artículo Texto
Lenguaje:English
Publicado: MDPI 2022
Materias:
Review
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC9608148/
https://www.ncbi.nlm.nih.gov/pubmed/36297876
http://dx.doi.org/10.3390/polym14204297

Internet

https://www.ncbi.nlm.nih.gov/pmc/articles/PMC9608148/
https://www.ncbi.nlm.nih.gov/pubmed/36297876
http://dx.doi.org/10.3390/polym14204297

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