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Progress of Polymer-Based Thermally Conductive Materials by Fused Filament Fabrication: A Comprehensive Review
With the miniaturization and integration of electronic products, the heat dissipation efficiency of electronic equipment needs to be further improved. Notably, polymer materials are a choice for electronic equipment matrices because of their advantages of low cost and wide application availability....
Autores principales: | Cai, Zewei, Thirunavukkarasu, Naveen, Diao, Xuefeng, Wang, Haoran, Wu, Lixin, Zhang, Chen, Wang, Jianlei |
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Formato: | Online Artículo Texto |
Lenguaje: | English |
Publicado: |
MDPI
2022
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Materias: | |
Acceso en línea: | https://www.ncbi.nlm.nih.gov/pmc/articles/PMC9608148/ https://www.ncbi.nlm.nih.gov/pubmed/36297876 http://dx.doi.org/10.3390/polym14204297 |
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