Reliability Assessment of Thermocompressed Epoxy Molding Compound through Glass via Interposer Architecture by the Submodeling Simulation Approach

In glass interposer architecture and its assembly process, the mechanical responses of interposer structure under thermocompression process-induced thermal loading and generated shrinkage of molding material are regarded as a major reliability issue. Thousands of metal-filled via are involved in gla...

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Detalles Bibliográficos
Autores principales: Wang, Shih-Hung, Hsu, Wensyang, Liou, Yan-Yu, Huang, Pei-Chen, Lee, Chang-Chun
Formato: Online Artículo Texto
Lenguaje:English
Publicado: MDPI 2022
Materias:
Article
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC9611184/
https://www.ncbi.nlm.nih.gov/pubmed/36295421
http://dx.doi.org/10.3390/ma15207357

Internet

https://www.ncbi.nlm.nih.gov/pmc/articles/PMC9611184/
https://www.ncbi.nlm.nih.gov/pubmed/36295421
http://dx.doi.org/10.3390/ma15207357

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