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Laser-Assisted Micro-Solder Bumping for Copper and Nickel–Gold Pad Finish
Flip-chip bonding is a key packaging technology to achieve the smallest form factor possible. Using copper as a direct under-bump metal and performing bonding under little force and at a low temperature eliminates the processing step for the deposition of a suitable wetting metal and offers an econo...
| Autores principales: | , , |
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| Formato: | Online Artículo Texto |
| Lenguaje: | English |
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MDPI
2022
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| Acceso en línea: | https://www.ncbi.nlm.nih.gov/pmc/articles/PMC9611501/ https://www.ncbi.nlm.nih.gov/pubmed/36295411 http://dx.doi.org/10.3390/ma15207349 |