Effects of Moisture Diffusion on a System-in-Package Module by Moisture–Thermal–Mechanical-Coupled Finite Element Modeling

Epoxy molding compounds (EMCs) are commonly used in electronic products for chip encapsulation, but the moisture absorption of EMC can induce significant reliability challenges. In this study, the effects of hygrothermal conditions and structure parameters on moisture diffusion and the consequent in...

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Detalles Bibliográficos
Autores principales: Chen, Zhiwen, Feng, Zheng, Ruan, Meng, Xu, Guoliang, Liu, Li
Formato: Online Artículo Texto
Lenguaje:English
Publicado: MDPI 2022
Materias:
Article
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC9611615/
https://www.ncbi.nlm.nih.gov/pubmed/36296057
http://dx.doi.org/10.3390/mi13101704

Internet

https://www.ncbi.nlm.nih.gov/pmc/articles/PMC9611615/
https://www.ncbi.nlm.nih.gov/pubmed/36296057
http://dx.doi.org/10.3390/mi13101704

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