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Analog and RF performance optimization for gate all around tunnel FET using broken-gap material

Many times, the fabricated cylindrical gate-all-around tunnel FET (GAA TFET) has an uneven radius due to several etching and deposition processes involved while fabricating the device, which show notable variations in the performance of the device. In this report, III–V uneven GAA TFET is studied by...

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Detalles Bibliográficos
Autores principales: Kumar, Pankaj, Koley, Kalyan, Mech, Bhubon C., Maurya, Ashish, Kumar, Subindu
Formato: Online Artículo Texto
Lenguaje:English
Publicado: Nature Publishing Group UK 2022
Materias:
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC9617921/
https://www.ncbi.nlm.nih.gov/pubmed/36309529
http://dx.doi.org/10.1038/s41598-022-22485-6
Descripción
Sumario:Many times, the fabricated cylindrical gate-all-around tunnel FET (GAA TFET) has an uneven radius due to several etching and deposition processes involved while fabricating the device, which show notable variations in the performance of the device. In this report, III–V uneven GAA TFET is studied by considering the uneven radius as elliptical in shape for all possible variations, which shows a significant impact on analog and RF figure of merits (FOMs). The performance of the optimized devices is compared with their circular structure and with their maximum deviation in elliptical geometry for all possible variations in device channel and gate oxide. The variations in its device channel and gate oxide have shown a significant impact on the performance of the device. The analog and RF FOMs are studied, including the transconductance generation factor (g(m)/I(DS)), intrinsic gain (g(m)R(O)), capacitances (C(GS), C(GD)), cut-off frequency (f(T)), and gate delay (τ(m)).