Database Development of SiO(2) Etching with Fluorocarbon Plasmas Diluted with Various Noble Gases of Ar, Kr, and Xe

In the semiconductor industry, fluorocarbon (FC) plasma is widely used in SiO(2) etching, with Ar typically employed in the dilution of the FC plasma due to its cost effectiveness and accessibility. While it has been reported that plasmas with other noble gases, namely Kr and Xe, have distinct physi...

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Detalles Bibliográficos
Autores principales: Lee, Youngseok, Yeom, Heejung, Choi, Daehan, Kim, Sijun, Lee, Jangjae, Kim, Junghyung, Lee, Hyochang, You, ShinJae
Formato: Online Artículo Texto
Lenguaje:English
Publicado: MDPI 2022
Materias:
Article
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC9658225/
https://www.ncbi.nlm.nih.gov/pubmed/36364604
http://dx.doi.org/10.3390/nano12213828

Internet

https://www.ncbi.nlm.nih.gov/pmc/articles/PMC9658225/
https://www.ncbi.nlm.nih.gov/pubmed/36364604
http://dx.doi.org/10.3390/nano12213828

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