TTQR: A Traffic- and Thermal-Aware Q-Routing for 3D Network-on-Chip

The die-stacking structure of 3D network-on-chips (3D NoC) leads to high power density and unequal thermal conductance between different layers, which results in low reliability and performance degradation of 3D NoCs. Congestion-aware adaptive routing, which is capable of balancing the network’s tra...

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Detalles Bibliográficos
Autores principales: Liu, Hanyan, Chen, Xiaowen, Zhao, Yunping, Li, Chen, Lu, Jianzhuang
Formato: Online Artículo Texto
Lenguaje:English
Publicado: MDPI 2022
Materias:
Article
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC9692818/
https://www.ncbi.nlm.nih.gov/pubmed/36433316
http://dx.doi.org/10.3390/s22228721

Internet

https://www.ncbi.nlm.nih.gov/pmc/articles/PMC9692818/
https://www.ncbi.nlm.nih.gov/pubmed/36433316
http://dx.doi.org/10.3390/s22228721

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