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TTQR: A Traffic- and Thermal-Aware Q-Routing for 3D Network-on-Chip
The die-stacking structure of 3D network-on-chips (3D NoC) leads to high power density and unequal thermal conductance between different layers, which results in low reliability and performance degradation of 3D NoCs. Congestion-aware adaptive routing, which is capable of balancing the network’s tra...
| Autores principales: | , , , , |
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| Formato: | Online Artículo Texto |
| Lenguaje: | English |
| Publicado: |
MDPI
2022
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| Materias: | |
| Acceso en línea: | https://www.ncbi.nlm.nih.gov/pmc/articles/PMC9692818/ https://www.ncbi.nlm.nih.gov/pubmed/36433316 http://dx.doi.org/10.3390/s22228721 |