Nondestructive Wafer Level MEMS Piezoelectric Device Thickness Detection

This paper introduces a novel nondestructive wafer scale thin film thickness measurement method by detecting the reflected picosecond ultrasonic wave transmitting between different interfacial layers. Unlike other traditional approaches used for thickness inspection, this method is highly efficient...

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Detalles Bibliográficos
Autores principales: Zhou, Yongxin, Gu, Yuandong, Zhang, Songsong
Formato: Online Artículo Texto
Lenguaje:English
Publicado: MDPI 2022
Materias:
Article
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC9693109/
https://www.ncbi.nlm.nih.gov/pubmed/36363937
http://dx.doi.org/10.3390/mi13111916

Internet

https://www.ncbi.nlm.nih.gov/pmc/articles/PMC9693109/
https://www.ncbi.nlm.nih.gov/pubmed/36363937
http://dx.doi.org/10.3390/mi13111916

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