Recent Studies on Thermally Conductive 3D Aerogels/Foams with the Segregated Nanofiller Framework

As technology advances toward ongoing circuit miniaturization and device size reduction followed by improved power density, heat dissipation is becoming a key challenge for electronic equipment. Heat accumulation can be prevented if the heat from electrical equipment is efficiently exported, ensurin...

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Detalles Bibliográficos
Autores principales: Owais, Mohammad, Shiverskii, Aleksei, Pal, Amit Kumar, Mahato, Biltu, Abaimov, Sergey G.
Formato: Online Artículo Texto
Lenguaje:English
Publicado: MDPI 2022
Materias:
Review
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC9695331/
https://www.ncbi.nlm.nih.gov/pubmed/36432922
http://dx.doi.org/10.3390/polym14224796

Internet

https://www.ncbi.nlm.nih.gov/pmc/articles/PMC9695331/
https://www.ncbi.nlm.nih.gov/pubmed/36432922
http://dx.doi.org/10.3390/polym14224796

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