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Recent Studies on Thermally Conductive 3D Aerogels/Foams with the Segregated Nanofiller Framework
As technology advances toward ongoing circuit miniaturization and device size reduction followed by improved power density, heat dissipation is becoming a key challenge for electronic equipment. Heat accumulation can be prevented if the heat from electrical equipment is efficiently exported, ensurin...
| Autores principales: | , , , , |
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| Formato: | Online Artículo Texto |
| Lenguaje: | English |
| Publicado: |
MDPI
2022
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| Materias: | |
| Acceso en línea: | https://www.ncbi.nlm.nih.gov/pmc/articles/PMC9695331/ https://www.ncbi.nlm.nih.gov/pubmed/36432922 http://dx.doi.org/10.3390/polym14224796 |