A Ku-Band Miniaturized System-in-Package Using HTCC for Radar Transceiver Module Application

This paper introduces a miniaturized system in package (SIP) for a Ku-band four-channel RF transceiver front-end. The SIP adopts the packaging scheme of an inner heat-dissipation gasket and multi-layer substrate in the high temperature co-fired ceramics (HTCC) shell with a metal heat sink at the bot...

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Detalles Bibliográficos
Autores principales: Yang, Fan, Zhang, Bowen, Song, Leijun
Formato: Online Artículo Texto
Lenguaje:English
Publicado: MDPI 2022
Materias:
Article
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC9695842/
https://www.ncbi.nlm.nih.gov/pubmed/36363838
http://dx.doi.org/10.3390/mi13111817

Internet

https://www.ncbi.nlm.nih.gov/pmc/articles/PMC9695842/
https://www.ncbi.nlm.nih.gov/pubmed/36363838
http://dx.doi.org/10.3390/mi13111817

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