The Polyol Process and the Synthesis of ζ Intermetallic Compound Ag(5)Sn(0.9)

The present work concerns the intermetallic compound (IMC) existing in the Ag–Sn system and its potential use in electronics as attachment materials allowing the adhesion of the chip to the substrate forming the power module. First, we present the synthesis protocol in polyol medium of a compound wi...

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Detalles Bibliográficos
Autores principales: Mahayri, Roland, Bousnina, Mohammed Ali, Mercone, Silvana, Tan, Ky-Lim, Morelle, Jean-Michel, Schoenstein, Frédéric, Jouini, Noureddine
Formato: Online Artículo Texto
Lenguaje:English
Publicado: MDPI 2022
Materias:
Article
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC9695861/
https://www.ncbi.nlm.nih.gov/pubmed/36431761
http://dx.doi.org/10.3390/ma15228276

Internet

https://www.ncbi.nlm.nih.gov/pmc/articles/PMC9695861/
https://www.ncbi.nlm.nih.gov/pubmed/36431761
http://dx.doi.org/10.3390/ma15228276

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