Cargando…

The Polyol Process and the Synthesis of ζ Intermetallic Compound Ag(5)Sn(0.9)

The present work concerns the intermetallic compound (IMC) existing in the Ag–Sn system and its potential use in electronics as attachment materials allowing the adhesion of the chip to the substrate forming the power module. First, we present the synthesis protocol in polyol medium of a compound wi...

Descripción completa

Detalles Bibliográficos
Autores principales:	Mahayri, Roland, Bousnina, Mohammed Ali, Mercone, Silvana, Tan, Ky-Lim, Morelle, Jean-Michel, Schoenstein, Frédéric, Jouini, Noureddine
Formato:	Online Artículo Texto
Lenguaje:	English
Publicado:	MDPI 2022
Materias:	Article
Acceso en línea:	https://www.ncbi.nlm.nih.gov/pmc/articles/PMC9695861/ https://www.ncbi.nlm.nih.gov/pubmed/36431761 http://dx.doi.org/10.3390/ma15228276

Ejemplares similares

Enhanced Magnetic Behavior of Cobalt Nano-Rods Elaborated by the Polyol Process Assisted with an External Magnetic Field
por: Bousnina, Mohamed Ali, et al.
Publicado: (2020)

Tailoring the magnetic properties of cobalt ferrite nanoparticles using the polyol process
por: Bibani, Malek, et al.
Publicado: (2019)

CoSn(3) Intermetallic Nanoparticles for Electronic Packaging
por: Wang, Jintao, et al.
Publicado: (2022)

LDH-Co-Fe-Acetate: A New Efficient Sorbent for Azoic Dye Removal and Elaboration by Hydrolysis in Polyol, Characterization, Adsorption, and Anionic Exchange of Direct Red 2 as a Model Anionic Dye
por: Drici-Setti, Nawal, et al.
Publicado: (2020)

Synthesis and Characterization of Pure Ni and Ni-Sn Intermetallic Nanoparticles
por: Yakymovych, A., et al.
Publicado: (2017)

The Role of Intermetallic Compounds in Controlling the Microstructural, Physical and Mechanical Properties of Cu-[Sn-Ag-Cu-Bi]-Cu Solder Joints
por: Sayyadi, Reza, et al.
Publicado: (2019)

Suppressed Growth of (Fe, Cr(,) Co(,) Ni(,) Cu)Sn(2) Intermetallic Compound at Interface between Sn-3.0Ag-0.5Cu Solder and FeCoNiCrCu(0.5) Substrate during Solid-state Aging
por: Shen, Yu-An, et al.
Publicado: (2019)

Suppression of the Growth of Intermetallic Compound Layers with the Addition of Graphene Nano-Sheets to an Epoxy Sn–Ag–Cu Solder on a Cu Substrate
por: Kang, Min-Soo, et al.
Publicado: (2019)

A New Reversible Phase Transformation of Intermetallic Ti(3)Sn
por: Du, Minshu, et al.
Publicado: (2019)

Aliovalent-doped sodium chromium oxide (Na(0.9)Cr(0.9)Sn(0.1)O(2) and Na(0.8)Cr(0.9)Sb(0.1)O(2)) for sodium-ion battery cathodes with high-voltage characteristics
por: Park, Woon Bae, et al.
Publicado: (2020)

Influence of nanoparticle addition on the formation and growth of intermetallic compounds (IMCs) in Cu/Sn–Ag–Cu/Cu solder joint during different thermal conditions
por: Ting Tan, Ai, et al.
Publicado: (2015)

Influence of Ag on the Properties of Ca(0.9)Yb(0.1)MnO(3) Sintered Ceramics
por: Sotelo, Andrés, et al.
Publicado: (2018)

Spin Coating and Micro-Patterning Optimization of Composite Thin Films Based on PVDF
por: Nguyen, Anh Ngoc, et al.
Publicado: (2020)

Damage Mechanism of Cu(6)Sn(5) Intermetallics Due to Cyclic Polymorphic Transitions
por: Zhang, Zhihao, et al.
Publicado: (2019)

Growth kinetics of Cu(6)Sn(5) intermetallic compound in Cu-liquid Sn interfacial reaction enhanced by electric current
por: Feng, Jiayun, et al.
Publicado: (2018)

The Prolific Ternary System Pt/Sn/Nd: Insertion of Pt into the Structures of Sn/Nd Intermetallics Yields Structural Complexity and Wealth
por: Celania, Chris, et al.
Publicado: (2023)

Effect of adding ZrM (M=Fe, Ni) intermetallic compounds on the hydrogen absorption/desorption properties of TiCr(1.1)V(0.9) alloy
por: Martínez-Amariz, A., et al.
Publicado: (2022)

Structural Characterization and Thermoelectric Properties of Br-Doped AgSn(m)[Sb(0.8)Bi(0.2)]Te(2+m) Systems
por: Delgado, Daniela, et al.
Publicado: (2023)

Synthesis of Delafossite-Type Ag(0.9)MnO(2) by the Precipitation Method at Room Temperature
por: Kato, Sumio, et al.
Publicado: (2019)

Upgrading Sustainable Polyurethane Foam Based on Greener Polyols: Succinic-Based Polyol and Mannich-Based Polyol
por: de Luca Bossa, Ferdinando, et al.
Publicado: (2020)

Magnetic Properties and Carrier Transport of Ir(0.9)Mn(1−x)Sn(1.1+x)
por: Pan, Diangang, et al.
Publicado: (2019)

On the possible separation of the phase enriched with Nb in superconducting intermetallic $Nb_3Sn$ irradiated with fast protons
por: Vasil'ev, A L, et al.
Publicado: (2017)

The Effect of CuSn Intermetallics on the Interstrand Contact Resistance in Superconducting Cables for the Large Hadron Collider (LHC)
por: Scheuerlein, C, et al.
Publicado: (2004)

Ternary Polar Intermetallics within the Pt/Sn/R Systems (R = La–Sm): Stannides or Platinides?
por: Rhodehouse, Melissa L., et al.
Publicado: (2020)

Microstructure and Optical Properties of Nanostructural Thin Films Fabricated through Oxidation of Au–Sn Intermetallic Compounds
por: Skowronski, Lukasz, et al.
Publicado: (2021)

Growth kinetics of Cu(6)Sn(5) intermetallic compound at liquid-solid interfaces in Cu/Sn/Cu interconnects under temperature gradient
por: Zhao, N., et al.
Publicado: (2015)

Preparation of highly dispersed SnO/TiO(2) catalysts and their performances in catalyzing polyol ester
por: Su, Huaigang, et al.
Publicado: (2023)

Growth mechanism of SnC(2)H(4)O(2) nanowires prepared by the polyol process as SnO(2) precursor nanowires
por: Park, DongKook, et al.
Publicado: (2019)

Intermetallic semiconducting films
por: Wieder, H H, et al.
Publicado: (1970)

Hydrogen in intermetallic compounds
por: Schlapbach, Louis
Publicado: (1988)

Hydrogen in intermetallic compunds
por: Schlapbach, Louis
Publicado: (1992)

Effect of FeCoNiCrCu(0.5) High-entropy-alloy Substrate on Sn Grain Size in Sn-3.0Ag-0.5Cu Solder
por: Shen, Yu-An, et al.
Publicado: (2019)

In Situ Formed Ag‐Li Intermetallic Layer for Stable Cycling of All‐Solid‐State Lithium Batteries
por: Choi, Hong Jun, et al.
Publicado: (2021)

Characterization of Ni(3)Sn intermetallic nanoparticles fabricated by thermal plasma process and catalytic properties for methanol decomposition
por: Xu, Ya, et al.
Publicado: (2019)

Intrinsic stability of magnetic anti-skyrmions in the tetragonal inverse Heusler compound Mn(1.4)Pt(0.9)Pd(0.1)Sn
por: Saha, Rana, et al.
Publicado: (2019)

Sn-doped Bi(1.1)Sb(0.9)Te(2)S bulk crystal topological insulator with excellent properties
por: Kushwaha, S. K., et al.
Publicado: (2016)

Influence of Texture on the Mechanical Properties of a Mg-6Al-1Zn-0.9Sn Alloy Processed by ECAP
por: Xu, Hong, et al.
Publicado: (2021)

Soldering Characteristics and Mechanical Properties of Sn-1.0Ag-0.5Cu Solder with Minor Aluminum Addition
por: Leong, Yee Mei, et al.
Publicado: (2016)

Cu(6)Sn(5) Whiskers Precipitated in Sn3.0Ag0.5Cu/Cu Interconnection in Concentrator Silicon Solar Cells Solder Layer
por: Zhang, Liang, et al.
Publicado: (2017)

Synthesis of Transesterified Palm Olein-Based Polyol and Rigid Polyurethanes from this Polyol
por: Arniza, Mohd Zan, et al.
Publicado: (2015)

Cannot write session to /tmp/vufind_sessions/sess_atvtsqvv97k1brm46j42ru6fgi