CoSn(3) Intermetallic Nanoparticles for Electronic Packaging

At present, composite solder pastes are getting a lot of attention, especially composite Sn based solders reinforced by nanoparticles. Indeed, CoSn(3) is a strong nucleating agent of Sn crystal, which has potential application value in the field of electronic packaging. However, there is no reliable...

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Detalles Bibliográficos
Autores principales: Wang, Jintao, Lv, Ziwen, Zhang, Luobin, Duan, Fangcheng, Zhang, Weiwei, Chen, Hongtao
Formato: Online Artículo Texto
Lenguaje:English
Publicado: MDPI 2022
Materias:
Article
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC9695973/
https://www.ncbi.nlm.nih.gov/pubmed/36432370
http://dx.doi.org/10.3390/nano12224083

Internet

https://www.ncbi.nlm.nih.gov/pmc/articles/PMC9695973/
https://www.ncbi.nlm.nih.gov/pubmed/36432370
http://dx.doi.org/10.3390/nano12224083

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