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CoSn(3) Intermetallic Nanoparticles for Electronic Packaging
At present, composite solder pastes are getting a lot of attention, especially composite Sn based solders reinforced by nanoparticles. Indeed, CoSn(3) is a strong nucleating agent of Sn crystal, which has potential application value in the field of electronic packaging. However, there is no reliable...
| Autores principales: | , , , , , |
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| Formato: | Online Artículo Texto |
| Lenguaje: | English |
| Publicado: |
MDPI
2022
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| Materias: | |
| Acceso en línea: | https://www.ncbi.nlm.nih.gov/pmc/articles/PMC9695973/ https://www.ncbi.nlm.nih.gov/pubmed/36432370 http://dx.doi.org/10.3390/nano12224083 |