Sawing Force Prediction Model and Experimental Study on Vibration-Assisted Diamond Wire Sawing

Diamond wire sawing is the main machining technology for slicing various brittle materials, such as crystalline silicon, SiC, and NdFeB. Due to their high hardness and high brittleness, as well as the ease with which the surfaces of machined materials are damaged, it is difficult to further improve...

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Detalles Bibliográficos
Autores principales: Zhang, Chenpu, Dong, Zhikui, Zhao, Yanheng, Liu, Ziliang, Wu, Shang, Yang, Jiahao
Formato: Online Artículo Texto
Lenguaje:English
Publicado: MDPI 2022
Materias:
Article
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC9696497/
https://www.ncbi.nlm.nih.gov/pubmed/36422455
http://dx.doi.org/10.3390/mi13112026

Internet

https://www.ncbi.nlm.nih.gov/pmc/articles/PMC9696497/
https://www.ncbi.nlm.nih.gov/pubmed/36422455
http://dx.doi.org/10.3390/mi13112026

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