Method for Keyhole-Free High-Aspect-Ratio Trench Refill by LPCVD

In micro-machined micro-electromechanical systems (MEMS), refilled high-aspect-ratio trench structures are used for different applications. However, these trenches often show keyholes, which have an impact on the performance of the devices. In this paper, explanations are given on keyhole formation,...

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Detalles Bibliográficos
Autores principales: Veltkamp, Henk-Willem, Janssens, Yves L., de Boer, Meint J., Zhao, Yiyuan, Wiegerink, Remco J., Tas, Niels R., Lötters, Joost C.
Formato: Online Artículo Texto
Lenguaje:English
Publicado: MDPI 2022
Materias:
Article
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC9699232/
https://www.ncbi.nlm.nih.gov/pubmed/36363929
http://dx.doi.org/10.3390/mi13111908

Internet

https://www.ncbi.nlm.nih.gov/pmc/articles/PMC9699232/
https://www.ncbi.nlm.nih.gov/pubmed/36363929
http://dx.doi.org/10.3390/mi13111908

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