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Copper laser patterning on a flexible substrate using a cost-effective 3D printer
We studied the cost effective direct laser patterning of copper (Cu) on thin polyimide substrates (PI thickness: 12.5–50 µm) using a 405 nm laser module attached to an inexpensive 3D printer. The focal length of the laser was intentionally controlled to reduce defects on patterned Cu and surface dam...
| Autores principales: | , , |
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| Formato: | Online Artículo Texto |
| Lenguaje: | English |
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Nature Publishing Group UK
2022
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| Materias: | |
| Acceso en línea: | https://www.ncbi.nlm.nih.gov/pmc/articles/PMC9729301/ https://www.ncbi.nlm.nih.gov/pubmed/36477714 http://dx.doi.org/10.1038/s41598-022-25778-y |