Ultralow Interfacial Thermal Resistance of Graphene Thermal Interface Materials with Surface Metal Liquefaction

Developing advanced thermal interface materials (TIMs) to bridge heat-generating chip and heat sink for constructing an efficient heat transfer interface is the key technology to solve the thermal management issue of high-power semiconductor devices. Based on the ultra-high basal-plane thermal condu...

Descripción completa

Detalles Bibliográficos
Autores principales: Dai, Wen, Ren, Xing-Jie, Yan, Qingwei, Wang, Shengding, Yang, Mingyang, Lv, Le, Ying, Junfeng, Chen, Lu, Tao, Peidi, Sun, Liwen, Xue, Chen, Yu, Jinhong, Song, Chengyi, Nishimura, Kazuhito, Jiang, Nan, Lin, Cheng-Te
Formato: Online Artículo Texto
Lenguaje:English
Publicado: Springer Nature Singapore 2022
Materias:
Article
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC9733747/
https://www.ncbi.nlm.nih.gov/pubmed/36484932
http://dx.doi.org/10.1007/s40820-022-00979-2

Internet

https://www.ncbi.nlm.nih.gov/pmc/articles/PMC9733747/
https://www.ncbi.nlm.nih.gov/pubmed/36484932
http://dx.doi.org/10.1007/s40820-022-00979-2

Ejemplares similares