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Ultralow Interfacial Thermal Resistance of Graphene Thermal Interface Materials with Surface Metal Liquefaction

Developing advanced thermal interface materials (TIMs) to bridge heat-generating chip and heat sink for constructing an efficient heat transfer interface is the key technology to solve the thermal management issue of high-power semiconductor devices. Based on the ultra-high basal-plane thermal condu...

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Detalles Bibliográficos
Autores principales:	Dai, Wen, Ren, Xing-Jie, Yan, Qingwei, Wang, Shengding, Yang, Mingyang, Lv, Le, Ying, Junfeng, Chen, Lu, Tao, Peidi, Sun, Liwen, Xue, Chen, Yu, Jinhong, Song, Chengyi, Nishimura, Kazuhito, Jiang, Nan, Lin, Cheng-Te
Formato:	Online Artículo Texto
Lenguaje:	English
Publicado:	Springer Nature Singapore 2022
Materias:	Article
Acceso en línea:	https://www.ncbi.nlm.nih.gov/pmc/articles/PMC9733747/ https://www.ncbi.nlm.nih.gov/pubmed/36484932 http://dx.doi.org/10.1007/s40820-022-00979-2

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