Microstructure and Shear Behaviour of Sn-3.0Ag-0.5Cu Composite Solder Pastes Enhanced by Epoxy Resin

With the rapid development of microelectronics packaging technology, the demand for high-performance packaging materials has further increased. This paper developed novel epoxy-containing Sn-3.0Ag-0.5Cu (SAC305-ER) composite solder pastes, and the effects of epoxy resin on their spreading performanc...

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Detalles Bibliográficos
Autores principales: Zhang, Peng, Xue, Songbai, Liu, Lu, Wu, Jie, Luo, Qingcheng, Wang, Jianhao
Formato: Online Artículo Texto
Lenguaje:English
Publicado: MDPI 2022
Materias:
Article
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC9735467/
https://www.ncbi.nlm.nih.gov/pubmed/36501697
http://dx.doi.org/10.3390/polym14235303

Internet

https://www.ncbi.nlm.nih.gov/pmc/articles/PMC9735467/
https://www.ncbi.nlm.nih.gov/pubmed/36501697
http://dx.doi.org/10.3390/polym14235303

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