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Microstructure and Shear Behaviour of Sn-3.0Ag-0.5Cu Composite Solder Pastes Enhanced by Epoxy Resin

With the rapid development of microelectronics packaging technology, the demand for high-performance packaging materials has further increased. This paper developed novel epoxy-containing Sn-3.0Ag-0.5Cu (SAC305-ER) composite solder pastes, and the effects of epoxy resin on their spreading performanc...

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Detalles Bibliográficos
Autores principales:	Zhang, Peng, Xue, Songbai, Liu, Lu, Wu, Jie, Luo, Qingcheng, Wang, Jianhao
Formato:	Online Artículo Texto
Lenguaje:	English
Publicado:	MDPI 2022
Materias:	Article
Acceso en línea:	https://www.ncbi.nlm.nih.gov/pmc/articles/PMC9735467/ https://www.ncbi.nlm.nih.gov/pubmed/36501697 http://dx.doi.org/10.3390/polym14235303

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