Analysis of Thermal Stress in Vanadium Dioxide Thin Films by Finite Element Method

The buckling, de-lamination, and cracking of the thin film/substrate system caused by thermal stress is the main obstacle for functional failure. Moreover, the thermal stress of vanadium dioxide (VO(2)) thin film may be more complicated due to the stress re-distribution caused by phase transition. T...

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Detalles Bibliográficos
Autores principales: Wang, Yuemin, Wang, Lebin, Gu, Jinxin, Yan, Xiangqiao, Lu, Jiarui, Dou, Shuliang, Li, Yao, Wang, Lei
Formato: Online Artículo Texto
Lenguaje:English
Publicado: MDPI 2022
Materias:
Article
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC9735821/
https://www.ncbi.nlm.nih.gov/pubmed/36500885
http://dx.doi.org/10.3390/nano12234262

Internet

https://www.ncbi.nlm.nih.gov/pmc/articles/PMC9735821/
https://www.ncbi.nlm.nih.gov/pubmed/36500885
http://dx.doi.org/10.3390/nano12234262

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