Study of Internal Stress in Conductive and Dielectric Thick Films

This paper is focused on the study of internal stress in thick films used in hybrid microelectronics. Internal stress in thick films arises after firing and during cooling due to the differing coefficients of thermal expansion in fired film and ceramic substrates. Different thermal expansions cause...

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Detalles Bibliográficos
Autores principales: Hlina, Jiri, Reboun, Jan, Janda, Martin, Hamacek, Ales
Formato: Online Artículo Texto
Lenguaje:English
Publicado: MDPI 2022
Materias:
Article
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC9738519/
https://www.ncbi.nlm.nih.gov/pubmed/36500182
http://dx.doi.org/10.3390/ma15238686

Internet

https://www.ncbi.nlm.nih.gov/pmc/articles/PMC9738519/
https://www.ncbi.nlm.nih.gov/pubmed/36500182
http://dx.doi.org/10.3390/ma15238686

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