Cargando…
Study of Internal Stress in Conductive and Dielectric Thick Films
This paper is focused on the study of internal stress in thick films used in hybrid microelectronics. Internal stress in thick films arises after firing and during cooling due to the differing coefficients of thermal expansion in fired film and ceramic substrates. Different thermal expansions cause...
Autores principales: | , , , |
---|---|
Formato: | Online Artículo Texto |
Lenguaje: | English |
Publicado: |
MDPI
2022
|
Materias: | |
Acceso en línea: | https://www.ncbi.nlm.nih.gov/pmc/articles/PMC9738519/ https://www.ncbi.nlm.nih.gov/pubmed/36500182 http://dx.doi.org/10.3390/ma15238686 |
_version_ | 1784847564878643200 |
---|---|
author | Hlina, Jiri Reboun, Jan Janda, Martin Hamacek, Ales |
author_facet | Hlina, Jiri Reboun, Jan Janda, Martin Hamacek, Ales |
author_sort | Hlina, Jiri |
collection | PubMed |
description | This paper is focused on the study of internal stress in thick films used in hybrid microelectronics. Internal stress in thick films arises after firing and during cooling due to the differing coefficients of thermal expansion in fired film and ceramic substrates. Different thermal expansions cause deflection of the substrate and in extreme cases, the deflection can lead to damage of the substrate. Two silver pastes and two dielectric pastes, as well as their combinations, were used for the experiments, and the internal stress in the thick films was investigated using the cantilever method. Further experiments were also focused on internal stress changes during the experiment and on the influence of heat treatment (annealing) on internal stress. The results were correlated with the morphology of the fired thick films. The internal stress in the thick films was in the range of 8 to 21 MPa for metallic films and in the range from 12 to 16 MPa for dielectric films. It was verified that the cantilever method can be successfully used for the evaluation of internal stress in thick films. It was also found that the values of deflection and internal stress are not stable after firing, and they can change over time, mainly for metallic thick films. |
format | Online Article Text |
id | pubmed-9738519 |
institution | National Center for Biotechnology Information |
language | English |
publishDate | 2022 |
publisher | MDPI |
record_format | MEDLINE/PubMed |
spelling | pubmed-97385192022-12-11 Study of Internal Stress in Conductive and Dielectric Thick Films Hlina, Jiri Reboun, Jan Janda, Martin Hamacek, Ales Materials (Basel) Article This paper is focused on the study of internal stress in thick films used in hybrid microelectronics. Internal stress in thick films arises after firing and during cooling due to the differing coefficients of thermal expansion in fired film and ceramic substrates. Different thermal expansions cause deflection of the substrate and in extreme cases, the deflection can lead to damage of the substrate. Two silver pastes and two dielectric pastes, as well as their combinations, were used for the experiments, and the internal stress in the thick films was investigated using the cantilever method. Further experiments were also focused on internal stress changes during the experiment and on the influence of heat treatment (annealing) on internal stress. The results were correlated with the morphology of the fired thick films. The internal stress in the thick films was in the range of 8 to 21 MPa for metallic films and in the range from 12 to 16 MPa for dielectric films. It was verified that the cantilever method can be successfully used for the evaluation of internal stress in thick films. It was also found that the values of deflection and internal stress are not stable after firing, and they can change over time, mainly for metallic thick films. MDPI 2022-12-06 /pmc/articles/PMC9738519/ /pubmed/36500182 http://dx.doi.org/10.3390/ma15238686 Text en © 2022 by the authors. https://creativecommons.org/licenses/by/4.0/Licensee MDPI, Basel, Switzerland. This article is an open access article distributed under the terms and conditions of the Creative Commons Attribution (CC BY) license (https://creativecommons.org/licenses/by/4.0/). |
spellingShingle | Article Hlina, Jiri Reboun, Jan Janda, Martin Hamacek, Ales Study of Internal Stress in Conductive and Dielectric Thick Films |
title | Study of Internal Stress in Conductive and Dielectric Thick Films |
title_full | Study of Internal Stress in Conductive and Dielectric Thick Films |
title_fullStr | Study of Internal Stress in Conductive and Dielectric Thick Films |
title_full_unstemmed | Study of Internal Stress in Conductive and Dielectric Thick Films |
title_short | Study of Internal Stress in Conductive and Dielectric Thick Films |
title_sort | study of internal stress in conductive and dielectric thick films |
topic | Article |
url | https://www.ncbi.nlm.nih.gov/pmc/articles/PMC9738519/ https://www.ncbi.nlm.nih.gov/pubmed/36500182 http://dx.doi.org/10.3390/ma15238686 |
work_keys_str_mv | AT hlinajiri studyofinternalstressinconductiveanddielectricthickfilms AT rebounjan studyofinternalstressinconductiveanddielectricthickfilms AT jandamartin studyofinternalstressinconductiveanddielectricthickfilms AT hamacekales studyofinternalstressinconductiveanddielectricthickfilms |