Cu-Ag Nanocomposite Pastes for Low Temperature Bonding and Flexible Interlayer-Interconnections

Cu-Ag composite pastes consisting of carboxylate-capped Ag nanoparticles, spray-pyrolyzed Ag submicron particles, and copper formate were developed in this study for low-temperature low-pressure bonding. The joints between the Cu, Ni/Au, and Ag finished substrates can be well formed at temperatures...

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Detalles Bibliográficos
Autores principales: Lu, Yin-Chi, Liao, Wei-Hsun, Wu, Ting-Jui, Yasuda, Kiyokazu, Song, Jenn-Ming
Formato: Online Artículo Texto
Lenguaje:English
Publicado: MDPI 2022
Materias:
Article
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC9738825/
https://www.ncbi.nlm.nih.gov/pubmed/36500864
http://dx.doi.org/10.3390/nano12234241

Internet

https://www.ncbi.nlm.nih.gov/pmc/articles/PMC9738825/
https://www.ncbi.nlm.nih.gov/pubmed/36500864
http://dx.doi.org/10.3390/nano12234241

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