Diffusion Barrier Properties of the Intermetallic Compound Layers Formed in the Pt Nanoparticles Alloyed Sn-58Bi Solder Joints Reacted with ENIG and ENEPIG Surface Finishes

Pt-nanoparticle (NP)-alloyed Sn-58Bi solders were reacted with electroless nickel-immersion gold (ENIG) and electroless nickel-electroless palladium-immersion gold (ENEPIG) surface finishes. We investigated formation of intermetallic compounds (IMCs) and their diffusion barrier properties at reactio...

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Detalles Bibliográficos
Autores principales: Choi, Hyeokgi, Kim, Chang-Lae, Sohn, Yoonchul
Formato: Online Artículo Texto
Lenguaje:English
Publicado: MDPI 2022
Materias:
Article
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC9740177/
https://www.ncbi.nlm.nih.gov/pubmed/36499917
http://dx.doi.org/10.3390/ma15238419

Internet

https://www.ncbi.nlm.nih.gov/pmc/articles/PMC9740177/
https://www.ncbi.nlm.nih.gov/pubmed/36499917
http://dx.doi.org/10.3390/ma15238419

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