Process Optimization of Injection Overmolding Structural Electronics with Regard to Film Distortion

The integration of structural electronics in injection-molded parts is a challenging step. The films—comprising of laminated stacks with electronics—are exposed to shear stresses and elevated temperatures by the molten thermoplastic. Hence, molding settings have a significant impact on the successfu...

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Detalles Bibliográficos
Autores principales: Hubmann, Martin, Madadnia, Behnam, Groten, Jonas, Pletz, Martin, Vanfleteren, Jan, Stadlober, Barbara, Bossuyt, Frederick, Kaur, Jatinder, Lucyshyn, Thomas
Formato: Online Artículo Texto
Lenguaje:English
Publicado: MDPI 2022
Materias:
Article
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC9740884/
https://www.ncbi.nlm.nih.gov/pubmed/36501457
http://dx.doi.org/10.3390/polym14235060

Internet

https://www.ncbi.nlm.nih.gov/pmc/articles/PMC9740884/
https://www.ncbi.nlm.nih.gov/pubmed/36501457
http://dx.doi.org/10.3390/polym14235060

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