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Process Optimization of Injection Overmolding Structural Electronics with Regard to Film Distortion
The integration of structural electronics in injection-molded parts is a challenging step. The films—comprising of laminated stacks with electronics—are exposed to shear stresses and elevated temperatures by the molten thermoplastic. Hence, molding settings have a significant impact on the successfu...
Autores principales: | Hubmann, Martin, Madadnia, Behnam, Groten, Jonas, Pletz, Martin, Vanfleteren, Jan, Stadlober, Barbara, Bossuyt, Frederick, Kaur, Jatinder, Lucyshyn, Thomas |
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Formato: | Online Artículo Texto |
Lenguaje: | English |
Publicado: |
MDPI
2022
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Materias: | |
Acceso en línea: | https://www.ncbi.nlm.nih.gov/pmc/articles/PMC9740884/ https://www.ncbi.nlm.nih.gov/pubmed/36501457 http://dx.doi.org/10.3390/polym14235060 |
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