High-Precision Wafer Bonding Alignment Mark Using Moiré Fringes and Digital Grating

This paper investigates a moiré-based mark for high-precision wafer bonding alignment. During alignment, the mark is combined with digital grating, which has the benefits of high precision and small size. A digital grating is superimposed on the mark to generate moiré fringes. By performing a phase...

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Detalles Bibliográficos
Autores principales: Fan, Jianhan, Lu, Sen, Zou, Jianxiao, Yang, Kaiming, Zhu, Yu, Liao, Kaiji
Formato: Online Artículo Texto
Lenguaje:English
Publicado: MDPI 2022
Materias:
Article
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC9782961/
https://www.ncbi.nlm.nih.gov/pubmed/36557458
http://dx.doi.org/10.3390/mi13122159

Internet

https://www.ncbi.nlm.nih.gov/pmc/articles/PMC9782961/
https://www.ncbi.nlm.nih.gov/pubmed/36557458
http://dx.doi.org/10.3390/mi13122159

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