Studies on Hot-Rolling Bonding of the Al-Cu Bimetallic Composite

Through the approaches in this article, an attempt was made to analyze the bonding of Al-Cu bimetallic composite layers and the highlight of the diffusion at the boundary between the layers, by hot rolling. An aluminum alloy 6060 plate (EN-AW AlMgSi) and a Cu-ETP ½ hard (CW004A) plate were used. All...

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Detalles Bibliográficos
Autores principales: Sas-Boca, Ioana-Monica, Iluțiu-Varvara, Dana-Adriana, Tintelecan, Marius, Aciu, Claudiu, Frunzӑ, Dan Ioan, Popa, Florin
Formato: Online Artículo Texto
Lenguaje:English
Publicado: MDPI 2022
Materias:
Article
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC9784321/
https://www.ncbi.nlm.nih.gov/pubmed/36556613
http://dx.doi.org/10.3390/ma15248807

Internet

https://www.ncbi.nlm.nih.gov/pmc/articles/PMC9784321/
https://www.ncbi.nlm.nih.gov/pubmed/36556613
http://dx.doi.org/10.3390/ma15248807

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