Aging Interfacial Structure and Abnormal Tensile Strength of SnAg3Cu0.5/Cu Solder Joints

In this study, the interfacial structure and abnormal long-term increase of tensile strength in the interfacial intermetallic compounds (IMCs) between SnAg3Cu0.5 solder and Cu substrates during isothermal aging were investigated. After reflow soldering, the IMC layer at the interface was thin and sc...

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Detalles Bibliográficos
Autores principales: Chen, Dongdong, Qin, Junhu, Zhang, Xin, Liang, Dongcheng, Bai, Hailong, Yi, Jianhong, Yan, Jikang
Formato: Online Artículo Texto
Lenguaje:English
Publicado: MDPI 2022
Materias:
Article
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC9784964/
https://www.ncbi.nlm.nih.gov/pubmed/36556810
http://dx.doi.org/10.3390/ma15249004

Internet

https://www.ncbi.nlm.nih.gov/pmc/articles/PMC9784964/
https://www.ncbi.nlm.nih.gov/pubmed/36556810
http://dx.doi.org/10.3390/ma15249004

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