Aging Interfacial Structure and Abnormal Tensile Strength of SnAg3Cu0.5/Cu Solder Joints

In this study, the interfacial structure and abnormal long-term increase of tensile strength in the interfacial intermetallic compounds (IMCs) between SnAg3Cu0.5 solder and Cu substrates during isothermal aging were investigated. After reflow soldering, the IMC layer at the interface was thin and scallop-type. The interfacial layer became thicker with the increase in aging time. After 200 h of aging at 150 °C, the thickness of the interface gradually increased to 3.93 μm and the interface became smooth. Compared with the unaged Cu-Sn interface, the aged joint interface contained more Cu(3)Sn. The top of the IMC being reflown was relatively smooth, but became denser and prismatic in shape after 200 h of aging at 150 °C. The tensile strength of the joint, immediately after the reflow, reached 81.93 MPa. The tensile properties of the solder joints weakened and then strengthened as they aged. After 200 h of aging at 150 °C, the tensile strength was 83.86 MPa, which exceeded that of the unaged solder joint interface, because the fracture mode of the solder joints changed during aging.