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Aging Interfacial Structure and Abnormal Tensile Strength of SnAg3Cu0.5/Cu Solder Joints

In this study, the interfacial structure and abnormal long-term increase of tensile strength in the interfacial intermetallic compounds (IMCs) between SnAg3Cu0.5 solder and Cu substrates during isothermal aging were investigated. After reflow soldering, the IMC layer at the interface was thin and sc...

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Autores principales: Chen, Dongdong, Qin, Junhu, Zhang, Xin, Liang, Dongcheng, Bai, Hailong, Yi, Jianhong, Yan, Jikang
Formato: Online Artículo Texto
Lenguaje:English
Publicado: MDPI 2022
Materias:
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC9784964/
https://www.ncbi.nlm.nih.gov/pubmed/36556810
http://dx.doi.org/10.3390/ma15249004
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author Chen, Dongdong
Qin, Junhu
Zhang, Xin
Liang, Dongcheng
Bai, Hailong
Yi, Jianhong
Yan, Jikang
author_facet Chen, Dongdong
Qin, Junhu
Zhang, Xin
Liang, Dongcheng
Bai, Hailong
Yi, Jianhong
Yan, Jikang
author_sort Chen, Dongdong
collection PubMed
description In this study, the interfacial structure and abnormal long-term increase of tensile strength in the interfacial intermetallic compounds (IMCs) between SnAg3Cu0.5 solder and Cu substrates during isothermal aging were investigated. After reflow soldering, the IMC layer at the interface was thin and scallop-type. The interfacial layer became thicker with the increase in aging time. After 200 h of aging at 150 °C, the thickness of the interface gradually increased to 3.93 μm and the interface became smooth. Compared with the unaged Cu-Sn interface, the aged joint interface contained more Cu(3)Sn. The top of the IMC being reflown was relatively smooth, but became denser and prismatic in shape after 200 h of aging at 150 °C. The tensile strength of the joint, immediately after the reflow, reached 81.93 MPa. The tensile properties of the solder joints weakened and then strengthened as they aged. After 200 h of aging at 150 °C, the tensile strength was 83.86 MPa, which exceeded that of the unaged solder joint interface, because the fracture mode of the solder joints changed during aging.
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spelling pubmed-97849642022-12-24 Aging Interfacial Structure and Abnormal Tensile Strength of SnAg3Cu0.5/Cu Solder Joints Chen, Dongdong Qin, Junhu Zhang, Xin Liang, Dongcheng Bai, Hailong Yi, Jianhong Yan, Jikang Materials (Basel) Article In this study, the interfacial structure and abnormal long-term increase of tensile strength in the interfacial intermetallic compounds (IMCs) between SnAg3Cu0.5 solder and Cu substrates during isothermal aging were investigated. After reflow soldering, the IMC layer at the interface was thin and scallop-type. The interfacial layer became thicker with the increase in aging time. After 200 h of aging at 150 °C, the thickness of the interface gradually increased to 3.93 μm and the interface became smooth. Compared with the unaged Cu-Sn interface, the aged joint interface contained more Cu(3)Sn. The top of the IMC being reflown was relatively smooth, but became denser and prismatic in shape after 200 h of aging at 150 °C. The tensile strength of the joint, immediately after the reflow, reached 81.93 MPa. The tensile properties of the solder joints weakened and then strengthened as they aged. After 200 h of aging at 150 °C, the tensile strength was 83.86 MPa, which exceeded that of the unaged solder joint interface, because the fracture mode of the solder joints changed during aging. MDPI 2022-12-16 /pmc/articles/PMC9784964/ /pubmed/36556810 http://dx.doi.org/10.3390/ma15249004 Text en © 2022 by the authors. https://creativecommons.org/licenses/by/4.0/Licensee MDPI, Basel, Switzerland. This article is an open access article distributed under the terms and conditions of the Creative Commons Attribution (CC BY) license (https://creativecommons.org/licenses/by/4.0/).
spellingShingle Article
Chen, Dongdong
Qin, Junhu
Zhang, Xin
Liang, Dongcheng
Bai, Hailong
Yi, Jianhong
Yan, Jikang
Aging Interfacial Structure and Abnormal Tensile Strength of SnAg3Cu0.5/Cu Solder Joints
title Aging Interfacial Structure and Abnormal Tensile Strength of SnAg3Cu0.5/Cu Solder Joints
title_full Aging Interfacial Structure and Abnormal Tensile Strength of SnAg3Cu0.5/Cu Solder Joints
title_fullStr Aging Interfacial Structure and Abnormal Tensile Strength of SnAg3Cu0.5/Cu Solder Joints
title_full_unstemmed Aging Interfacial Structure and Abnormal Tensile Strength of SnAg3Cu0.5/Cu Solder Joints
title_short Aging Interfacial Structure and Abnormal Tensile Strength of SnAg3Cu0.5/Cu Solder Joints
title_sort aging interfacial structure and abnormal tensile strength of snag3cu0.5/cu solder joints
topic Article
url https://www.ncbi.nlm.nih.gov/pmc/articles/PMC9784964/
https://www.ncbi.nlm.nih.gov/pubmed/36556810
http://dx.doi.org/10.3390/ma15249004
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