Cargando…

Aging Interfacial Structure and Abnormal Tensile Strength of SnAg3Cu0.5/Cu Solder Joints

In this study, the interfacial structure and abnormal long-term increase of tensile strength in the interfacial intermetallic compounds (IMCs) between SnAg3Cu0.5 solder and Cu substrates during isothermal aging were investigated. After reflow soldering, the IMC layer at the interface was thin and sc...

Descripción completa

Detalles Bibliográficos
Autores principales:	Chen, Dongdong, Qin, Junhu, Zhang, Xin, Liang, Dongcheng, Bai, Hailong, Yi, Jianhong, Yan, Jikang
Formato:	Online Artículo Texto
Lenguaje:	English
Publicado:	MDPI 2022
Materias:	Article
Acceso en línea:	https://www.ncbi.nlm.nih.gov/pmc/articles/PMC9784964/ https://www.ncbi.nlm.nih.gov/pubmed/36556810 http://dx.doi.org/10.3390/ma15249004

Ejemplares similares

Soldering Characteristics and Mechanical Properties of Sn-1.0Ag-0.5Cu Solder with Minor Aluminum Addition
por: Leong, Yee Mei, et al.
Publicado: (2016)

Size effect model on kinetics of interfacial reaction between Sn-xAg-yCu solders and Cu substrate
por: Huang, M. L., et al.
Publicado: (2014)

Effect of Tin Grain Orientation on Electromigration-Induced Dissolution of Ni Metallization in SnAg Solder Joints
por: Hsu, Po-Ning, et al.
Publicado: (2022)

Effect of Multiple Reflows on the Interfacial Reactions and Mechanical Properties of an Sn-0.5Cu-Al(Si) Solder and a Cu Substrate
por: Son, Junhyuk, et al.
Publicado: (2021)

Cu(6)Sn(5) Whiskers Precipitated in Sn3.0Ag0.5Cu/Cu Interconnection in Concentrator Silicon Solar Cells Solder Layer
por: Zhang, Liang, et al.
Publicado: (2017)

Crystallographic Characteristic Effect of Cu Substrate on Serrated Cathode Dissolution in Cu/Sn–3.0Ag–0.5Cu/Cu Solder Joints during Electromigration
por: Yue, Wu, et al.
Publicado: (2021)

Effect of FeCoNiCrCu(0.5) High-entropy-alloy Substrate on Sn Grain Size in Sn-3.0Ag-0.5Cu Solder
por: Shen, Yu-An, et al.
Publicado: (2019)

The Effect of Epoxy Polymer Addition in Sn-Ag-Cu and Sn-Bi Solder Joints
por: Kang, Min-Soo, et al.
Publicado: (2019)

Thermo-Compression Bonding of Cu/SnAg Pillar Bumps with Electroless Palladium Immersion Gold (EPIG) Surface Finish
por: Jun, So-Yeon, et al.
Publicado: (2023)

Author Correction: Effect of FeCoNiCrCu(0.5) High-entropy-alloy Substrate on Sn Grain Size in Sn-3.0Ag-0.5Cu Solder
por: Shen, Yu-An, et al.
Publicado: (2020)

Microstructure and Shear Behaviour of Sn-3.0Ag-0.5Cu Composite Solder Pastes Enhanced by Epoxy Resin
por: Zhang, Peng, et al.
Publicado: (2022)

The Role of Intermetallic Compounds in Controlling the Microstructural, Physical and Mechanical Properties of Cu-[Sn-Ag-Cu-Bi]-Cu Solder Joints
por: Sayyadi, Reza, et al.
Publicado: (2019)

The In-Situ Observation of Grain Rotation and Microstructure Evolution Induced by Electromigration in Sn-3.0Ag-0.5Cu Solder Joints
por: Fu, Xing, et al.
Publicado: (2020)

Thermochemical Mechanism of the Epoxy-Glutamic Acid Reaction with Sn-3.0 Ag-0.5 Cu Solder Powder for Electrical Joining
por: Choi, Gwang-Mun, et al.
Publicado: (2021)

Suppressed Growth of (Fe, Cr(,) Co(,) Ni(,) Cu)Sn(2) Intermetallic Compound at Interface between Sn-3.0Ag-0.5Cu Solder and FeCoNiCrCu(0.5) Substrate during Solid-state Aging
por: Shen, Yu-An, et al.
Publicado: (2019)

Effect of Kaolin Geopolymer Ceramics Addition on the Microstructure and Shear Strength of Sn-3.0Ag-0.5Cu Solder Joints during Multiple Reflow
por: Zaimi, Nur Syahirah Mohamad, et al.
Publicado: (2022)

Thermal Cycling Life Prediction of Sn-3.0Ag-0.5Cu Solder Joint Using Type-I Censored Data
por: Mi, Jinhua, et al.
Publicado: (2014)

The Microstructure, Thermal, and Mechanical Properties of Sn-3.0Ag-0.5Cu-xSb High-Temperature Lead-Free Solder
por: Li, Chaojun, et al.
Publicado: (2020)

Influence of nanoparticle addition on the formation and growth of intermetallic compounds (IMCs) in Cu/Sn–Ag–Cu/Cu solder joint during different thermal conditions
por: Ting Tan, Ai, et al.
Publicado: (2015)

Effect of Isothermal Annealing on Sn Whisker Growth Behavior of Sn0.7Cu0.05Ni Solder Joint
por: Hashim, Aimi Noorliyana, et al.
Publicado: (2023)

Experimental and Statistical Study of the Fracture Mechanism of Sn96.5Ag3Cu0.5 Solder Joints via Ball Shear Test
por: Liang, Kun, et al.
Publicado: (2022)

Suppression of the Growth of Intermetallic Compound Layers with the Addition of Graphene Nano-Sheets to an Epoxy Sn–Ag–Cu Solder on a Cu Substrate
por: Kang, Min-Soo, et al.
Publicado: (2019)

Study on Microstructure and Mechanical Properties at Constant Electromigration Temperature of Sn2.5Ag0.7Cu0.1RE0.05Ni-GNSs/Cu Solder Joints
por: Zhang, Chao, et al.
Publicado: (2023)

Effect of Trace Zn Addition on Interfacial Evolution in Sn-10Bi/Cu Solder Joints during Aging Condition
por: Wang, Qingfeng, et al.
Publicado: (2019)

Dynamic Observation of Interfacial IMC Evolution and Fracture Mechanism of Sn2.5Ag0.7Cu0.1RE/Cu Lead-Free Solder Joints during Isothermal Aging
por: Zhao, Di, et al.
Publicado: (2020)

Microstructure and Electro-Physical Properties of Sn-3.0Ag-0.5Cu Nanocomposite Solder Reinforced with Ni Nanoparticles in the Melting-Solidification Temperature Range
por: Yakymovych, A., et al.
Publicado: (2017)

Performance of Sn-3.0Ag-0.5Cu Composite Solder with Kaolin Geopolymer Ceramic Reinforcement on Microstructure and Mechanical Properties under Isothermal Ageing
por: Zaimi, Nur Syahirah Mohamad, et al.
Publicado: (2021)

Effect of Grain Structure and Ni/Au-UBM Layer on Electromigration-Induced Failure Mechanism in Sn-3.0Ag-0.5Cu Solder Joints
por: Zhang, Yuanxiang, et al.
Publicado: (2022)

Microstructure evolution, IMC growth, and microhardness of Cu, Ni, Ag-microalloyed Sn–5Sb/Cu solder joints under isothermal aging
por: Xin, Meiling, et al.
Publicado: (2022)

Microstructure Evolution and Shear Strength of the Cu/Au80Sn20/Cu Solder Joints with Multiple Reflow Temperatures
por: Chen, Chaoyu, et al.
Publicado: (2022)

Interfacial Reaction and IMC Growth of an Ultrasonically Soldered Cu/SAC305/Cu Structure during Isothermal Aging
por: Li, Yulong, et al.
Publicado: (2018)

Structure and properties of Sn-Cu lead-free solders in electronics packaging
por: Zhao, Meng, et al.
Publicado: (2019)

Interfacial Reaction and Electromigration Failure of Cu Pillar/Ni/Sn-Ag/Cu Microbumps under Bidirectional Current Stressing
por: Fu, Zhiwei, et al.
Publicado: (2023)

Effects of Static Heat and Dynamic Current on Al/Zn∙Cu/Sn Solder/Ag Interfaces of Sn Photovoltaic Al-Ribbon Modules
por: Chen, Kuan-Jen, et al.
Publicado: (2018)

Wettability of Sn-3.0Ag-0.5Cu Solder Reinforced with TiO(2) and Al(2)O(3) Nanoparticles at Different Reflow Times
por: Mohamed Muzni, Nur Haslinda, et al.
Publicado: (2023)

Effect of Ni on the Suppression of Sn Whisker Formation in Sn-0.7Cu Solder Joint
por: Hashim, Aimi Noorliyana, et al.
Publicado: (2021)

Effect of Thermal Aging on the Interfacial Reaction Behavior and Failure Mechanism of Ni-xCu/Sn Soldering Joints under Shear Loading
por: Li, Zhigang, et al.
Publicado: (2023)

Application of ZnO Nanoparticles in Sn99Ag0.3Cu0.7-Based Composite Solder Alloys
por: Skwarek, Agata, et al.
Publicado: (2021)

Microstructures and Properties of Sn2.5Ag0.7Cu0.1RE Composite Solders Reinforced with Cu-Coated Graphene Nanosheets Synthesized by Pyrolysis
por: Zhang, Meng, et al.
Publicado: (2019)

Interfacial Reaction and Mechanical Properties of Sn-Bi Solder joints
por: Wang, Fengjiang, et al.
Publicado: (2017)

Cannot write session to /tmp/vufind_sessions/sess_1itiqeha4ppkoh71i6f6m6cqk8