Fabrication of Ultra-Fine Micro-Vias in Non-Photosensitive Polyimide for High-Density Vertical Interconnects

With the growing demands for transferring large amounts of data between components in a package, it is required for advanced packaging technologies to form smaller vertical vias in the insulators. Plasma etching is one of the most widely used micro-vias formation processes. This paper has developed...

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Detalles Bibliográficos
Autores principales: Wang, Yao, Hu, Chuan, Xiang, Xun, Zheng, Wei, Yin, Zhendong, Cui, Yinhua
Formato: Online Artículo Texto
Lenguaje:English
Publicado: MDPI 2022
Materias:
Article
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC9786021/
https://www.ncbi.nlm.nih.gov/pubmed/36557379
http://dx.doi.org/10.3390/mi13122081

Internet

https://www.ncbi.nlm.nih.gov/pmc/articles/PMC9786021/
https://www.ncbi.nlm.nih.gov/pubmed/36557379
http://dx.doi.org/10.3390/mi13122081

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