Void Suppression in Glass Frit Bonding Via Three-Step Annealing Process

In this work, void formation was systematically observed for the glass frit bonding technique as a function of the annealing temperature, annealing time, and annealing ambient. High annealing temperature and long annealing time were adopted to reach the maximum heat flux to avoid voids/bubbles. As d...

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Detalles Bibliográficos
Autores principales: Liu, Yifang, Chen, Junyu, Jiang, Jiaxin, Zheng, Gaofeng
Formato: Online Artículo Texto
Lenguaje:English
Publicado: MDPI 2022
Materias:
Article
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC9787505/
https://www.ncbi.nlm.nih.gov/pubmed/36557403
http://dx.doi.org/10.3390/mi13122104

Internet

https://www.ncbi.nlm.nih.gov/pmc/articles/PMC9787505/
https://www.ncbi.nlm.nih.gov/pubmed/36557403
http://dx.doi.org/10.3390/mi13122104

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