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Void Suppression in Glass Frit Bonding Via Three-Step Annealing Process
In this work, void formation was systematically observed for the glass frit bonding technique as a function of the annealing temperature, annealing time, and annealing ambient. High annealing temperature and long annealing time were adopted to reach the maximum heat flux to avoid voids/bubbles. As d...
Autores principales: | Liu, Yifang, Chen, Junyu, Jiang, Jiaxin, Zheng, Gaofeng |
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Formato: | Online Artículo Texto |
Lenguaje: | English |
Publicado: |
MDPI
2022
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Materias: | |
Acceso en línea: | https://www.ncbi.nlm.nih.gov/pmc/articles/PMC9787505/ https://www.ncbi.nlm.nih.gov/pubmed/36557403 http://dx.doi.org/10.3390/mi13122104 |
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