Thermal, Mechanical and Dielectric Properties of Polyimide Composite Films by In-Situ Reduction of Fluorinated Graphene

Materials with outstanding mechanical properties and excellent dielectric properties are increasingly favored in the microelectronics industry. The application of polyimide (PI) in the field of microelectronics is limited because of the fact that PI with excellent mechanical properties does not have...

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Detalles Bibliográficos
Autores principales: Zhang, Yuyin, Hu, Tian, Hu, Rubei, Jiang, Shaohua, Zhang, Chunmei, Hou, Haoqing
Formato: Online Artículo Texto
Lenguaje:English
Publicado: MDPI 2022
Materias:
Article
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC9788081/
https://www.ncbi.nlm.nih.gov/pubmed/36558028
http://dx.doi.org/10.3390/molecules27248896

Internet

https://www.ncbi.nlm.nih.gov/pmc/articles/PMC9788081/
https://www.ncbi.nlm.nih.gov/pubmed/36558028
http://dx.doi.org/10.3390/molecules27248896

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