Effectiveness of Dimple Microtextured Copper Substrate on Performance of Sn-0.7Cu Solder Alloy

This paper elucidates the influence of dimple-microtextured copper substrate on the performance of Sn-0.7Cu solder alloy. A dimple with a diameter of 50 µm was produced by varying the dimple depth using different laser scanning repetitions, while the dimple spacing was fixed for each sample at 100 µ...

Descripción completa

Detalles Bibliográficos
Autores principales: Roduan, Siti Faqihah, Wahab, Juyana A., Salleh, Mohd Arif Anuar Mohd, Mahayuddin, Nurul Aida Husna Mohd, Abdullah, Mohd Mustafa Al Bakri, Halil, Aiman Bin Mohd, Zaifuddin, Amira Qistina Syamimi, Muhammad, Mahadzir Ishak, Sandu, Andrei Victor, Baltatu, Mădălina Simona, Vizureanu, Petrica
Formato: Online Artículo Texto
Lenguaje:English
Publicado: MDPI 2022
Materias:
Article
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC9820858/
https://www.ncbi.nlm.nih.gov/pubmed/36614433
http://dx.doi.org/10.3390/ma16010096

Internet

https://www.ncbi.nlm.nih.gov/pmc/articles/PMC9820858/
https://www.ncbi.nlm.nih.gov/pubmed/36614433
http://dx.doi.org/10.3390/ma16010096

Ejemplares similares