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Effectiveness of Dimple Microtextured Copper Substrate on Performance of Sn-0.7Cu Solder Alloy
This paper elucidates the influence of dimple-microtextured copper substrate on the performance of Sn-0.7Cu solder alloy. A dimple with a diameter of 50 µm was produced by varying the dimple depth using different laser scanning repetitions, while the dimple spacing was fixed for each sample at 100 µ...
Autores principales: | Roduan, Siti Faqihah, Wahab, Juyana A., Salleh, Mohd Arif Anuar Mohd, Mahayuddin, Nurul Aida Husna Mohd, Abdullah, Mohd Mustafa Al Bakri, Halil, Aiman Bin Mohd, Zaifuddin, Amira Qistina Syamimi, Muhammad, Mahadzir Ishak, Sandu, Andrei Victor, Baltatu, Mădălina Simona, Vizureanu, Petrica |
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Formato: | Online Artículo Texto |
Lenguaje: | English |
Publicado: |
MDPI
2022
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Materias: | |
Acceso en línea: | https://www.ncbi.nlm.nih.gov/pmc/articles/PMC9820858/ https://www.ncbi.nlm.nih.gov/pubmed/36614433 http://dx.doi.org/10.3390/ma16010096 |
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