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Cu(3)Sn joint based on transient liquid phase bonding of Cu@Cu(6)Sn(5) core–shell particles
With the development of high-integration and high-power electronics, the lack of matching chip connecting materials that can withstand high temperatures has been a challenge. In this manuscript, a Cu@Cu(6)Sn(5) core–shell bimetallic particles (approx. 1 μm in diameter) are successfully prepared and...
| Autores principales: | , , , |
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| Formato: | Online Artículo Texto |
| Lenguaje: | English |
| Publicado: |
Nature Publishing Group UK
2023
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| Materias: | |
| Acceso en línea: | https://www.ncbi.nlm.nih.gov/pmc/articles/PMC9837067/ https://www.ncbi.nlm.nih.gov/pubmed/36635376 http://dx.doi.org/10.1038/s41598-023-27870-3 |