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Cu(3)Sn joint based on transient liquid phase bonding of Cu@Cu(6)Sn(5) core–shell particles

With the development of high-integration and high-power electronics, the lack of matching chip connecting materials that can withstand high temperatures has been a challenge. In this manuscript, a Cu@Cu(6)Sn(5) core–shell bimetallic particles (approx. 1 μm in diameter) are successfully prepared and...

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Detalles Bibliográficos
Autores principales:	Wang, Jintao, Wang, Jianqiang, Duan, Fangcheng, Chen, Hongtao
Formato:	Online Artículo Texto
Lenguaje:	English
Publicado:	Nature Publishing Group UK 2023
Materias:	Article
Acceso en línea:	https://www.ncbi.nlm.nih.gov/pmc/articles/PMC9837067/ https://www.ncbi.nlm.nih.gov/pubmed/36635376 http://dx.doi.org/10.1038/s41598-023-27870-3

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