Through-Silicon via Device Non-Destructive Defect Evaluation Using Ultra-High-Resolution Acoustic Microscopy System

In this study, an ultra-high-resolution acoustic microscopy system capable of non-destructively evaluating defects that may occur in thin film structures was fabricated. It is an integrated system of the control module, activation module, and data acquisition system, in which an integrated control s...

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Detalles Bibliográficos
Autores principales: Kim, Tae Hyeong, Kang, Dongchan, Kim, Jeong Nyeon, Park, Ik Keun
Formato: Online Artículo Texto
Lenguaje:English
Publicado: MDPI 2023
Materias:
Article
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC9860617/
https://www.ncbi.nlm.nih.gov/pubmed/36676597
http://dx.doi.org/10.3390/ma16020860

Internet

https://www.ncbi.nlm.nih.gov/pmc/articles/PMC9860617/
https://www.ncbi.nlm.nih.gov/pubmed/36676597
http://dx.doi.org/10.3390/ma16020860

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