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An Experimental and Numerical Study on Glass Frit Wafer-to-Wafer Bonding

A thermo-mechanical wafer-to-wafer bonding process is studied through experiments on the glass frit material and thermo-mechanical numerical simulations to evaluate the effect of the residual stresses on the wafer warpage. To experimentally characterize the material, confocal laser profilometry and...

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Detalles Bibliográficos
Autores principales: Farshchi Yazdi, Seyed Amir Fouad, Garavaglia, Matteo, Ghisi, Aldo, Corigliano, Alberto
Formato: Online Artículo Texto
Lenguaje:English
Publicado: MDPI 2023
Materias:
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC9860824/
https://www.ncbi.nlm.nih.gov/pubmed/36677226
http://dx.doi.org/10.3390/mi14010165