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An Experimental and Numerical Study on Glass Frit Wafer-to-Wafer Bonding
A thermo-mechanical wafer-to-wafer bonding process is studied through experiments on the glass frit material and thermo-mechanical numerical simulations to evaluate the effect of the residual stresses on the wafer warpage. To experimentally characterize the material, confocal laser profilometry and...
| Autores principales: | , , , |
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| Formato: | Online Artículo Texto |
| Lenguaje: | English |
| Publicado: |
MDPI
2023
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| Materias: | |
| Acceso en línea: | https://www.ncbi.nlm.nih.gov/pmc/articles/PMC9860824/ https://www.ncbi.nlm.nih.gov/pubmed/36677226 http://dx.doi.org/10.3390/mi14010165 |